Our test equipment will enable you to meet all standards and specifications. Whether for applications, device characterization, debugging, failure analysis or industrial process development and R&D. Manual and semi-automatic probe stations are versatile and precise to meet the requirements of microelectronics.

Manual Probe Stations

Manual probe technology allows testing of single GeneChips or multiple NICs on whole or partial wafers of up to 300 mm for all data types of the system.

-Manual movement of vacuum chucks and microscopes

Basic low-cost models,wafer test or economical multi-purpose or sub-micron high precision

-Special configurations for testing requirements: low current, high power....

Configurable and upgradable with optional options: hot chuck, 3-axis connection, and isolation box (cassette)....

- Standardized for frequency DC or high frequency (RF)

Economical probe stage for single chips or wafers up to 200 mm and lists of Unicode geometries or wires up to a few micrometers

- Standard for manual DC versions or HF using microwave models

-Microscope column accepts binoculars (basic) or high magnification (turreted multi-eye only on SS160)

Up to 10 positioners (depending on model) with magnetic or vacuum base.

- Optional hot chuck for applications at ambient temperature

- Range of accessories and options

A range of highly accurate and precise sub-micron probing stations for testing small plates or very small internal nodes.failure analysis 12 inches from a chip to a portion of a wafer or an entire wafer

Rugged base with very low noise once placed on the shaker.

-Chucks, standard, 3-axis, thermal control in various configurations....

High-end positioners for optimal accuracy.

- Customized configurations based on specification sheets

Semi-Automatic Probe Table

Semi-automatic control of the probes will allow the student user to perform a complete test on a part or an entire wafer, automatically and very reproducibly.

-Pattern recognition software (new version) eliminates positioning errors by accurately identifying where the tip needs to land.

Workstations are available in a variety of configurations depending on wafer size and the level of automation required.

- High Frequency RF Modeling

‧Movement control via external GPIB or built-in software

Various accessories and options to match all specific applications, wafer level testing temperature measurement, femtosecond, high power...

-Perfect human choice for chip characterization, design method verification, failure problem analysis and low to medium production (manual wafer loading)

Compact Thermal Probe Station

This device is designed to probe samples at temperatures up to 4 in.

Variable temperatures from 80k to 573k

-Vacuum capacity down to 8.10 -3torr

- Gas can be injected

- Accepts up to 4 positioners