The PAC200 semi-automatic cryogenic probe is the ideal solution for automated testing of wafers and substrates up to 300mm in cryogenic environments (liquid nitrogen down to 77K or liquid helium below 20K). It supports a wide range of applications.

Today, industry icons and emerging companies are investing heavily in new uses for superconductor technology. That said, there are huge challenges to address that threaten the future of computing infrastructures that support our growing demand for data, computing power and connected devices. Quantum computing (based on quantum bits) promises to usher in a new era of artificial intelligence, complex system optimization, medical molecular modeling, cryptography, and more. Superconducting cold CPUs using RSFQ (Rapid Single Flux Quantum), RQL (Reciprocal Quantum Logic), or similar new families of logic are expected to eliminate the huge energy and heat problems that limit the growth and siting of HPC (High Performance Computing) supercomputers and exascale data centers.

These new low-temperature processor developments will need to be carried out memory, and to maintain their energy resource advantage,wafer testing the memory management system must also be cold. Superconducting memory may we still need a few years, but as the results of the study show that traditional CMOS DRAM structures can be analyzed at low temperatures such as 77K very able to effectively improve the use. Cryogenic wafer testing is needed to tune the production process and determine the temperatures at which data memory components can be used at these operating temperatures.

The PAC200 semi-automated cryogenic probe is an ideal solution for automated testing of 300mm wafers and substrates at cryogenic temperatures of 77K or below 20K in liquid helium using liquid nitrogen. It supports a wide range of applications including DC and RF measurements of the latest silicon, compound semiconductor and superconductor devices. The probe board is designed for mounting a probe card or up to eight vacuum-type positioners on magnetic feet. To minimize heat ingress,wafer probe the probes or probe clips are thermally secured to a cryogenic shield. The high resolution video microscope has a travel range of 50 mm x 50 mm and can be mounted on a rotating microscope stand or microscope bridge for vibration sensitive test applications and other test instruments.

The following are some of the notable features and benefits that make the PAC200 probe system flexible, stable and easy to use.

The system can be customized to meet user requirements.

It offers different substrate carriers for wafers up to 300 mm or individual chips

Motorized stage development provides a programmable step that can test as well as multiple chips on an entire wafer.

Probe station control software automates testing and increases productivity.

The system offers a wide range of electrical measurements (IV, CV, dual-port, multi-port and differential RF).

A variety of probes and calibration tools (such as calibration substrates and WinCal XE? calibration software).

Additional test equipment (e.g., IR light sources and optics) can be used.

The vacuum chamber and heat shield provide ice-free and condensation-free probe system functionality down to 77K (liquid nitrogen) or below 20K (liquid helium).

The plate supports up to 8 thermal anchors,probe holder removable probe positioners, or easily replaceable probe cards to increase the number of probes.

Highly stable mechanics with a vibration isolated platform provide high probe placement accuracy - ideal for small pads.